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BP1109S-0541
1. SPECIFICATION
Piezoelectric Ceramic Buzzer SMD
1 | Dimension | 11.0X9.0X1.8 |
2 | Net Weight | Approx 0.5g |
3 | Resonant Frequency | 4100±500 Hz |
4 | Operating Voltage | 1～20Vp-p |
5 | Rated Current | Max.7mA ,at 4.1KHz 50% duty Square Wave 5Vp-p |
6 | Sound Output | Min. 75dB,at 4.1KHz 50% duty Square Wave 5Vp-p |
7 | Capacitance | 12000pF±30%,at 120Hz |
8 | Operating Temperature | -20℃～+70℃ |
9 | Store Temperature | -30℃～+80℃ |
10 | RoHS | Yes |
Dimensions Unit: mm
*Unit: mm; Tolerance: ±0.3mm Except Specified
*Housing Material: Black LCP
2. Reliability Test
After any following tests the part shall meet specifications without any degradation in
appearance and performance except SPL. SPL shall not deviate more than -10 dB
from the initial value
2.1 Ordinary Temperature Life Test
The part shall be subjected to 96 hours at 25±10℃. Input rated voltage
Resonant frequency, 1/2 duty Square wave.
2.2 High Temperature Test
The part shall be capable of with standing a storage temperature of +85℃ for 96 hours.
2.3 Low Temperature Test
The part shall be capable of with standing a storage temperature of -40℃ for 96 hours.
2.4 Humidity Test
Temperature:+40℃±3℃ Relative Humidity:90%～95% Duration: 48 hours
and expose to room temperature for 6 hours
2.5 Temperature Shock Test
Temperature:70℃ /1hour→ 25℃/3hours→-30℃/1hour→ 25℃/3hours (1cycle)
Total cycle: 10 cycles
2.6 Drop Test
Standard Packaging From 1.2m(Drop on hard wood or board of 5cm thick,
three sides, six plain.)
2.7 Vibration Test
Vibration:1000cycles /min. Amplitude:1.5mm, Duration: 1 hour in each 3 axes
Note:
As this product is not protected from foreign material entering, please make sure that any foreign materials (e.g. magnetic powder, washing solvent, flux, corrosive gas) do not enter this product in your production processes. The functional degradation (e.g. SPL down) may occur if foreign material enter it.
3. Electrical And Acoustical Measuring Condition
3.1 Recommended Setting
4. Frequency Response
5Vp-p 50% duty Square wave,10cm
5. Surface mounting condition
5.1 Reflow soldering
Recommendable reflow soldering condition is as follows.
Note: (1) In automated mounting of the SMD sound transducers on PCB, any bending, expanding
and pulling forces or shocks against the SMD sound transducers shall be kept minimum
to prevent them from electrical failures and mechanical damages of the devices.
(2) In the reflow soldering, too high soldering temperatures and too large temperature
Gradient such as rapid heating or cooling may cause electrical failures and mechanical
damages of the devices.
6. Packing
6.1Dimension Of Carrier Tape
6.2Dimension Of Plastic Reel
7. Inside Structure
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